BP3109

Custom

BP3109

3U CompactPCI  PlusIO® backplane
Key features:
  • Conforms to latest PICMG
  • 10-layer, high-performance, low noise stripline design
  • Custom configurations available 
  • PICMG 2.0 R3.0 CompactPCI specification compliant
  • PICMG 2.1 R1.0 cPCI Hot Swap specification compliant
  • Hybrid configuration provides 5x standard CPCI slots and 2 x CPCI Serial (S.0) peripheral slots
  • V(I/O) adjustable to +3.3 V or +5 V 
  • Digital GND can be connected to isolated from chassis GND by means of screws.
Technical Data
Electrical Specifications

  • Backplane Connectors: IEC 1076-4-101, 2 mm press-fit pin and socket
  • Connector Pitch: 4 HP (0.8") spacing
  • Insulation Resistance: acc. IEC 512-5
  • Transmission Rate:
    - 132 M byt es/s ( peak) for 32-bi t transmi ssions @ 33 MHz
    - 264 Mbyt es/s ( peak) for 32-bi t transmi ssions @ 66 MHz
  • · Characteristic of Impedance: 65 ohms ±10%
Mechanical Specifications
  • Dimensions: conforming to CompactPCI Serial specification for 3U boards
  • Weight: 200g
  • Backplane Material: FR4
Environmental Specifications 
  • Temperature range (operation): - 40.. +85°C
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300m to + 3,000m
  • Shock: 15g/11ms
  • Bump: 10g/16ms
  • Vibration (sinusoidal): 2g/10..200Hz
  • Conformalcoating on request
MTBF 
  • 500 000 h @ 40°C (derived from MIL-HDBK-217F)

Documentation

BP3109- : 570.9